SMT Resistors

FC version for Flip Chip Mounting for SMT Applications

• Resistance as low as 0.010 ohm at ±5%
• Power ratings for FC version up to 1.5 watts at +70°C ambient
• For high power substrates, thermal resistance as low as 11.5°C/watt
• Non-inductive design

WB version for Wire Bonding for Hybrid Applications

• Resistance as low as 0.020 ohm at ±5%
• Wire bondable version for heavy aluminum wire bonds
• Power ratings for WB versions up to 15 watts based on maintaining 25°C on the chip mounting surface
• For high power substrates, thermal resistance as low as 8.33°C/watt
• Non-inductive design

FC version for Flip Chip Mounting for SMT Applications

• Resistance range from 10 Megs to 100 Megs
• 8 Standard resistance values
• Tolerance 1% standard
• Temperature coefficient to as low as 25 ppm/°C
• High stability
• Custom resistance values and tolerances available

FC version for Flip Chip Mounting for SMT Applications

• Resistance as low as 0.010 ohm at ±1%
• Power ratings for FC version up to 1.5 watts at +70°C ambient
• For high power substrates, thermal resistance as low as 9.0°C/watt
• Non-inductive design

WB version for Wire Bonding for Hybrid Applications

• Resistance as low as 0.010 ohm at ±1%
• Wire bondable version with unique pedestal terminals to receive heavy aluminum wire bonds
• Power ratings for WB versions up to 20 watts based on maintaining 25°C on the chip mounting surface
• For high power substrates, thermal resistance as low as 5.00°C/watt
• Non-inductive design

• 25 watts at 25°C case temperature derated to zero at +150°C
• Metal tab assists in post-soldering inspection
• Resistance range of 0.020 ohm to 1.00K
• Non-inductive design